Seite - 115 - in Photovoltaic Materials and Electronic Devices
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transparency [8,9]. In the case of small cells, this hurdle can be masked using
small dimensions and addition of a patterned metallic grid to the TCO, thereby
compensating for its low conductivity. Such a combination of materials can increase
the efficiency by creating a dramatic shift in conductivity at the expense of only a
small loss in transmittance [10,11].
Classic wafer based cells do not have a TCO and fully rely on metallic grids.
Therefore, the cell layout and ink requirements are highly different from the desired
characteristicsofmonolithically interconnectedthinfilmcells,whichrequiressmaller
feature sizes and, in the case of thin film CIGS cells, limited annealing temperatures
below 200˝C. A few studies of grid on TCO were performed, but these reflected the
statusof ink jetprinting, resulting in low(<1µm)and100µmwidegrids. Because
of these low and wide grid dimensions, there was hardly an advantage of this
TCO + metal grid approach compared to the TCO only approach [12–15]. Therefore,
in solar panel production, this solution has not been adopted for monolithically
interconnectedsolarcells.
Recently, however, the full potential of the application of metallic grids with
optimized finger and cell dimensions (i.e., lower width and larger height) was
reportedtogiveasignificantboost in thinfilmsolarefficiencies [16]. Becausesuch
approachwouldaddcomplexity in themanufacturingprocess, theefficiencygain
should be determined and evaluated with respect to manufacturing issues. Previous
study [16,17] was performed on cells with efficiencies of 15.5% and many aspects
such as cell layout and absorber material band gap, were not discussed in depth.
Moreover, previous designs did not take into account the material interface issue
of contact resistance. The investigation of contact resistance in solar cells has only
briefly been touched [18,19] and its impact on design of monolithically integrated
solarpanelsstillneeds tobeaddressed. Moreover, thepreviouscasewas limitedto
lowefficiencyCIGSororganicPV[15,16]andthecase forhighefficiencythinfilm
solar cells, spanning a wide range of band gaps should be investigated. In short,
there isa lackofknowledgeof the impactof thecell layoutandspecificmetal-TCO
interaction (e.g., contact resistance) on the preferred grid design and the expected
efficiencybenefit.
This work focuses on the introduction of metal finger grid to enhance the
performance of thin film solar panels with up-to-date cell efficiencies of 19%. The
effects of cell length and interconnection area, as well as the band gap of the
absorber material and the contact resistance are modeled. In contrast to previous
work reflecting a rather idealized situation, specific issues such as the losses due
to the specific contact resistance and the impact of reduced irradiation intensity
arediscussed. Thecalculatedcell efficienciesgiveguidelinesoverawiderangeof
(non-ideal) circumstances foruseful frontcontact technologies thataimtoenhance
the thinfilmsolarpanelefficiency.
115
Photovoltaic Materials and Electronic Devices
- Titel
- Photovoltaic Materials and Electronic Devices
- Autor
- Joshua M. Pearce
- Herausgeber
- MDPI
- Ort
- Basel
- Datum
- 2016
- Sprache
- englisch
- Lizenz
- CC BY-NC-ND 4.0
- ISBN
- 978-3-03842-217-4
- Abmessungen
- 17.0 x 24.4 cm
- Seiten
- 216
- Schlagwörter
- Perovskite, Plasmonics, Nanostructured Materials, Anti-Reflection Coatings, Transparent Conductive Oxides, Amorphous Silicon, Dye-sensitized Solar Cells (DSSCs) Materials, Organic Photovoltaic Materials, Solar Energy Materials
- Kategorien
- Naturwissenschaften Physik
- Technik